PLC system simulation input and output development trend and design challenge

PLC system simulation input and output development trend and design challenge

Since its entry into China in the late 1970s, PLC has grown by more than 30 years. I do not know you are reading the article, remember the first PLC circuit you participate in the design? Now, PLC and DCS are still playing a major role in the field of industrial control, and are moving towards smaller modules, faster, more channel density High direction.

Take a typical I / O card in a PLC rack socket as an example. At present, the common size of an 8-channel module is generally 90mm × 70mm × 23.5mm. However, driven by the market demand, card-sized products have come out. Channel density or increase in the number of modules can not only enhance the function, but also can increase the price competitiveness of products, naturally popular. However, how to reduce the size of the module? How to meet the above requirements at the same time solve the resulting self-heating problems? How to design low-power? These are PLC system design are also faced with practical problems.

ADI Process Control Series, "Four Key Design Sections for Industrial Field Loop-Powered Instrumentation ," has conducted an in-depth analysis of the design requirements and challenges of field instrumentation / transmitters as a companion to this article Will focus on the PLC / DCS system in the analog input and output part of the development trend. The input and output modules are differentiated here and discussed separately for their different system requirements, highlighting the latest ADI products and solutions that support these requirements.

Multi-channel fully integrated analog output solution

Analog output is about integration, energy efficiency and performance. First, the module size is smaller. At present, designers have long been in the product design by selecting 0402 package resistor capacitance and LFCSP package IC, to achieve the purpose of reducing the size of the circuit board. At the same time, the power consumption of each module from the previous 5W-10W, to the current 3W-5W, the future is bound to drop to even lower. In this regard, some designers to meet the power budget by sacrificing design specifications, although this method can achieve the purpose of reducing power consumption, but it will inevitably lead to reduced product competitiveness, it is not recommended.

Second, the channel density to increase, from the original 4-channel, 8-channel increase to the current 12 or even 16 channels. It is well known that constant space and increased channel density significantly increase the ambient temperature of the module and in some cases it is not uncommon for system ambient temperatures of up to 100 degrees Celsius to pose a challenge to the highest IC junction temperature. Moreover, the increase in channel density also means that the number of components and power consumption increase, which on the other hand requires designers to select components, smaller size, lower quiescent current and more efficient.

Third, speed, that is, set up time to improve, in order to achieve factory automation. The time it takes to set up an analog output channel has now been reduced to 20μs, but is still moving toward higher efficiency.

Fourthly, the process safety requirements should also be raised. The system should introduce Safety Integrity Level (SIL) to improve diagnosis and stability.

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